Intel Xeon Platinum 8468H & 8470 Processors (CPUs): Specifications, Compatibility, Price & Upgrade

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Aug 14
4 min read

Updated: Aug 15

This article covers two of Intel’s top 4th Gen Xeon Scalable “Sapphire Rapids” CPUs — the Intel Xeon Platinum 8468H (SRM7S) and Intel Xeon Platinum 8470 (SRM75).

Intel Xeon Platinum 8468H & 8470 Processors

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It includes technical specifications, cross-vendor compatibility (Dell, HPE, Lenovo, Cisco UCS, Fujitsu), upgrade considerations, price, and workload recommendations.

Intel Xeon Platinum 8468H & 8470 Processors (CPUs) – specs, server compatibility, pricing, and workload tips for AI, HPC, and enterprise systems. server-parts.eu refurbished

Technical Specifications - Intel Xeon Platinum 8468H & 8470 CPUs

Feature	Intel Xeon Platinum 8468H (SRM7S)	Intel Xeon Platinum 8470 (SRM75)
Cores / Threads	48 / 96	52 / 104
Base / Max Turbo	2.1 GHz / up to 3.8 GHz	2.0 GHz / up to 3.8 GHz
L3 Cache	105 MB	105 MB
TDP	330 W	350 W
Socket	FCLGA4677 (LGA4677)	FCLGA4677 (LGA4677)
Memory	DDR5-4800, ECC, 8-channel (up to 4400 MT/s at 2DPC)	DDR5-4800, ECC, 8-channel (up to 4400 MT/s at 2DPC)
PCIe	Gen 5.0, 80 lanes	Gen 5.0, 80 lanes
UPI Links	4 @ 16 GT/s	4 @ 16 GT/s

Key difference: The 8468H trades 4 cores for a slightly higher base frequency and lower TDP (330 W), making it easier to fit into thermal and power budgets. The 8470 maximizes core count at the cost of higher power requirements (350 W).

Multi-Vendor Server Compatibility - Intel Xeon Platinum 8468H & 8470 CPUs

Dell PowerEdge

R760 (16th Gen, 2U, dual-socket): Supports up to 350 W CPUs with the correct chassis, heatsinks, airflow, and PSU. Ambient temperature may be limited to 30 °C for top-TDP parts.
R660 (16th Gen, 1U, dual-socket): Can support up to 350 W CPUs in specific “MAX” configurations, but most standard air-cooled builds have a practical limit below 270 W — making 8468H/8470 uncommon in this chassis.

HPE ProLiant (Gen11)

DL380 Gen11 (2U): Officially supports both CPUs. >205 W requires a High-Performance Fan Kit; >150 W requires Performance Heat Sinks.
DL360 Gen11: Similar logic to DL380 — ensure chassis and cooling kits match CPU TDP.

Lenovo ThinkSystem (V3)

SR650 V3 (2U): Supports both CPUs via official option kits, provided the high-performance fans and airflow baffles are installed.
SR630 V3 (1U): Tighter thermals; high-TDP SKUs possible only in certain configs.
SR860 V3 / SR950 V3: Multi-socket, high-performance systems — both CPUs supported with correct thermal setup.

Cisco UCS (M7)

X410c M7 (modular compute node): Officially supports 8468H; 8470 support depends on the specific UCS chassis/blade model — check Cisco’s current HCL for confirmation.

Fujitsu PRIMERGY (M7)

RX2540 M7 / RX8770 M7: Support for high-TDP 4th Gen Xeons, including H-SKUs, is configuration-dependent. Check thermal and PSU requirements for your build.

8468H vs 8470 Side-by-Side - Intel Xeon Platinum 8468H & 8470 CPUs

Feature	8468H (SRM7S)	8470 (SRM75)
Cores / Threads	48 / 96	52 / 104
Base / Turbo (GHz)	2.1 / 3.8	2.0 / 3.8
L3 Cache	105 MB	105 MB
TDP	330 W	350 W
Best Fit	Balanced perf with lower TDP	Max threads for parallel-heavy workloads
Cooling Need	High-performance fans & heatsinks	Same, but with stricter thermal margins

Price & Availability - Intel Xeon Platinum 8468H & 8470 CPUs

Intel list prices are high, over 15.000 EUR, but OEM and channel pricing varies greatly by region and deal size.
Refurbished market price is about 8.000 EUR.
Tray/OEM parts may be available through brokers and refurb suppliers at a fraction of list price.
Availability fluctuates with AI/HPC demand; lead times can be weeks for large orders.

Upgrade Considerations - Intel Xeon Platinum 8468H & 8470 CPUs

Common to all vendors:

Cooling: Both CPUs require high-performance heatsinks/fan kits; 8470’s 350 W TDP demands strict airflow and possible ambient temperature limits (often ≤30 °C).
Power: Dual high-TDP CPUs plus GPUs/NVMe may require 2.4–3.2 kW PSUs.
Firmware: Update BIOS/UEFI, BMC/iDRAC/iLO/XCC before installation.
Memory: Populate all channels for bandwidth; actual DDR5 speed depends on DIMM type and population.

Vendor-specific notes:

Dell: Check thermal support matrices; some storage/GPU configs limit high-TDP CPU use.
HPE: >205 W = High-Performance Fan Kit; >150 W = Performance Heat Sinks.
Lenovo: Order correct CPU option kit (includes heatsink/air baffle).
Cisco UCS: Verify with CPU support matrix for your blade/rack model.
Fujitsu: Check for liquid-cooling or enhanced fan wall options in dense builds.

Workload Recommendations - Intel Xeon Platinum 8468H & 8470 CPUs

Virtualization / Mixed Cloud: 8468H’s balance of cores and frequency works well for dense VM workloads with tight power limits.
HPC / Analytics / In-Memory Databases: 8470’s 52 cores shine in parallel-heavy compute where cooling capacity is available.
AI Inference with GPUs: Choose based on total rack power budget — sometimes 8468H leaves more thermal headroom for additional GPUs.

Conclusion - Intel Xeon Platinum 8468H & 8470 CPUs

The Intel Xeon Platinum 8468H (SRM7S) and Intel Xeon Platinum 8470 (SRM75) are both top-tier options for modern 2-socket enterprise servers.

Choose Intel Xeon Platinum 8468H (SRM7S) for high performance in more thermally restricted environments.
Choose Intel Xeon Platinum 8470 (SRM75) when your infrastructure supports 350 W CPUs and your workloads can exploit every additional core.